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5

Capability

Inner layer

Outer layer

Laser via pads

Mechanical via pads

Aspect ratio

Solder resist

Solder mask clearance

Copper thickness

Min Dielectric thickness

HDI

Max panel size

Standard

Max panel thickness

Max layer count

Min mechanical hole

Buried pair mechanical

Min diameter laser via

Buried pair laser

Mechanical depth control

Control impedance

Tracks

External Pads

Internal Pads

External Pads

Internal Pads

Min

Max

Min

Max

Min

Max

Min

Min

Min

Min

+/-

%

Current

50 micron - 2 mils

50 micron - 2 mils

75 micron - 3 mils

75 micron - 3 mils

0.250 mm - 10 mils

300 micron - 12 mils

450 micron - 18 mils

500 micron - 20 mils

10:1

40 micron

12 micron

210 micron

25 micron

1+N+1

5+N+5

24x21

24x18

5.00mm

40

0.250 mm - 10 mils

0.150 mm - 6 mils

0.10 mm - 4 mils

0.070 mm - 2.8 mils

+/- 25 microns

+/- 10%

Advanced

38 microns - 1.5 mils

38 microns - 1.5 mils

63 micron - 2.2 mils

63 micron - 2.2 mils

200 micron - 8 mils

225 micron - 9 mils

350 micron - 14 mils

450 micron - 18 mils

11:1

38 micron

9 Micron

210 micron

25 micron

1+N+1

6+N+6

24x21

24x18

5.3mm

50

0.200 mm - 8 mils

0.150 mm - 6 mils

0.075 mm - 3 mils

<0.070 mm - 2.8 mils

+/- 15 microns

+/- 7%

Road Map

25 microns - 0.8 mils

25 microns - 0.8 mils

50 micron - 2 mils

50 micron - 2 mils

150 micron - 6 mils

200 micron - 8 mils

350 micron - 12 mils

425 micron - 16 mils

12:1

20 micron

5 Micron

>210 micron

<25 micron

1+N+1

>6+N+6

>24x21

>24x18

>5.3mm

>50

0.150 - 6 mils

0.150 mm - 6 mils

0.050 mm - 2 mils

<0.070 mm - 2.8 mils

+/- 10 microns

+/- 7%

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