5
Capability
Inner layer
Outer layer
Laser via pads
Mechanical via pads
Aspect ratio
Solder resist
Solder mask clearance
Copper thickness
Min Dielectric thickness
HDI
Max panel size
Standard
Max panel thickness
Max layer count
Min mechanical hole
Buried pair mechanical
Min diameter laser via
Buried pair laser
Mechanical depth control
Control impedance
Tracks
External Pads
Internal Pads
External Pads
Internal Pads
Min
Max
Min
Max
Min
Max
Min
Min
Min
Min
+/-
%
Current
50 micron - 2 mils
50 micron - 2 mils
75 micron - 3 mils
75 micron - 3 mils
0.250 mm - 10 mils
300 micron - 12 mils
450 micron - 18 mils
500 micron - 20 mils
10:1
40 micron
12 micron
210 micron
25 micron
1+N+1
5+N+5
24x21
24x18
5.00mm
40
0.250 mm - 10 mils
0.150 mm - 6 mils
0.10 mm - 4 mils
0.070 mm - 2.8 mils
+/- 25 microns
+/- 10%
Advanced
38 microns - 1.5 mils
38 microns - 1.5 mils
63 micron - 2.2 mils
63 micron - 2.2 mils
200 micron - 8 mils
225 micron - 9 mils
350 micron - 14 mils
450 micron - 18 mils
11:1
38 micron
9 Micron
210 micron
25 micron
1+N+1
6+N+6
24x21
24x18
5.3mm
50
0.200 mm - 8 mils
0.150 mm - 6 mils
0.075 mm - 3 mils
<0.070 mm - 2.8 mils
+/- 15 microns
+/- 7%
Road Map
25 microns - 0.8 mils
25 microns - 0.8 mils
50 micron - 2 mils
50 micron - 2 mils
150 micron - 6 mils
200 micron - 8 mils
350 micron - 12 mils
425 micron - 16 mils
12:1
20 micron
5 Micron
>210 micron
<25 micron
1+N+1
>6+N+6
>24x21
>24x18
>5.3mm
>50
0.150 - 6 mils
0.150 mm - 6 mils
0.050 mm - 2 mils
<0.070 mm - 2.8 mils
+/- 10 microns
+/- 7%
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